Boix Chile held its First Open Days, under the slogan “Solutions for the Chilean Packaging Sector”.
First of all, we would like to express our sincere thanks to all those who participated in the event, customers, suppliers, collaborators and colleagues, because without them this event would not have been possible.
It should be noted that the conference was held in 2 sessions, and that we had the participation of more than 100 leaders and managers of some of the most important Chilean companies in the sector. These conferences not only served as a meeting point and exchange of ideas, but we also set as our main objective to bring together customers, suppliers and business partners, so that together we could analyze and reflect on the situation and prospects of the sector, in addition to the idea of creating an environment focused on networking where each participant could find or generate opportunities or contacts.
The conference took place at our facilities in Boix Chile, for which different spaces were set up, such as:
- Machine exhibition area: where the attendees were able to see in operation the latest innovations in case erector and capper machines, tray erectors, stackers, conveyors, etc.
- Cardboard Pallet Zone: as a novelty for the Chilean market, a stand was set up to present the new development of cardboard pallets presented by Green Ox, a pallet that represents an ecological and sustainable alternative to traditional wood and plastic pallets.
- Guerola Zone: Visitors were also able to learn about the different adhesive solutions: Hotmelts, waxes and kerosene waxes that the manufacturer Guerola has been developing for the Chilean market.
- Meeting Zone: a meeting space set up so that, in an informal way, and while enjoying the catering, all attendees could meet or gather and exchange ideas and opinions.
- Conference Zone: 3 presentations were given by: Boix Chile, Green Ox and Guerola, with the aim of presenting their latest developments, along with some success stories that we believe could be interesting for the Chilean market, it should be noted that it was a colloquium format where attendees could give their opinions, ask questions and contribute their own experiences.
We are confident that events such as this one will reinforce and contribute to boost innovation in the Chilean packaging sector.
We look forward to seeing you in future editions and would like to once again reiterate our sincere thanks to all attendees.
